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Applications
	Semiconductor Package Assembly
		Underfill Dam & Fill Chip Encapsulation Chip Scale Package Cavity Fill Die Attach Lid Seal No Flow Underfill Flux Jetting Thermal Compounds
	SMT/PCB Assembly
	Industrial Applications
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Cavity Fill Dispensing

Maximizing throughput is achieved by optimizing the volumetric accuracy, flow rate, and fill patterns of the dispensing process. Asymtek's DP Series Linear Pump and proprietary fill-pattern technology create the highest throughput cavity-fill dispensers available today.

Superior volumetric control delivers accurate fill heights for consistent wirebond coverage and fill flatness.

The DP Series Linear Pump delivers 1%, 3 sigma repeatability for a typical shot size of 300 mg, despite changes in fluid viscosity.

Contact and non-contact part-heating options, either contact or impingement, offer maximum flexibility.

Dispensing Systems

M-2020 Millennium® Ultra High Speed Semiconductor Dispenser
X-1020 Axiom™ Semiconductor Dispenser
S-820 Spectrum™ Precision Batch Semiconductor Dispenser

Pumps & Valves

DP-3000 Linear Positive Displacement Pump