Die Attach
 Asymtek's
technology has proven ideal for dispensing the electrically conductive
materials and non-conductive epoxies used for critical die-attach
operations.
Die attach fluids, like silver epoxy, can be deposited by either
standard needle dispensing or by jetting, depending on the application.
Contact Asymtek for more information.
Using programmable dispensing patterns and precise volume control,
Asymtek systems can deliver excellent die-attach results for Chip-on-Board
(COB) and Multi-Chip Module (MCM) applications. PCB assembly customers
can readily integrate Asymtek's dispensing system into their chip-level
die attach operations, while tailoring the dispense process to meet
production requirements.
Dispensing Systems
- M-2020 Millennium® Ultra High Speed Semiconductor Dispenser
- X-1020 Axiom™ Semiconductor Dispenser
- S-820 Spectrum™ Precision Batch Semiconductor Dispenser
Jets, Pumps & Valves
- DJ-9000 DispenseJet® The Latest Jet Technology
- DP-3000 Linear Positive Displacement Pump
- DV-7000 Heli-Flow® Pump
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