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Semiconductor Package Assembly
 

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Application Notes & Dispensing Tips


Lid Seal Dispensing

Lid sealant dispensing is often the final dispensing process in semiconductor package assembly. With Fluidmove® for Windows® , you can program a weight-controlled bead of sealant to ensure a continuous seal. Asymtek's versatile platforms can be converted to dispense solder paste or thermal grease of your process needs change.

Superior volumetric accuracy, 1%, 3 sigma repeatability ensures consistent, part-to-part reliability.

Programmable weight-controlled arcs and lines ensure consistent connection of bead start and endpoints for uniform bead cross-section.

Up to 177 ml (6 oz.) material reservoir enables extended periods of uninterrupted production.

Dispensing Systems

  • X-1010 Axiom SMT Dispenser
  • X-1020 Axiom Semiconductor Dispenser
  • S-820 Spectrum Precision Batch Semiconductor Dispenser

 Pumps & Valves

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