Selective Flux Jetting
 Selective
flux jetting can improve throughput by as much as 20-30 percent
- simultaneously optimizing underfill reliability, production throughput
and equipment utilization.
As technologies such as flip chip and CSP (chip scale package)
migrate into your high-volume production line, sustainable throughput
and consistent quality have become critical factors for success.
The efficient application of flux in precise, thin patterns is crucial
to maximizing both throughput and quality.
Through its pioneering development of robust production-oriented
underfill processes, Asymtek identified this critical link between
flux application and underfill quality. As bump sizes decrease,
it is more difficult to control dipping operations to consistently
deliver smaller amounts of flux. Too much flux, excessive flux residue,
or inconsistent flux application significantly degrade the ability
of the underfill encapsulant to uniformly adhere to all surfaces
beneath the chip. This increases the risk of voids in the underfill,
delamination between part and substrate, and ultimately, a reduction
in product reliability.
Asymtek has responded to these challenges with the development
of new, production-oriented flux jet dispensing processes. Selective
flux jetting provides a high-speed, highly adaptable process for
flux dispensing in virtually any pattern. The coaxial air technology
ensures consistent ultra-thin flux film builds by following the
jetted flux with a pulse of air.
Dispensing Systems
- C-730 Century® Selective Flux Dispenser
- X-1030 Axiom™ Flux Dispenser
- X-1032 Axiom™ Flux Dual-Lane Dispenser
Jets, Pumps & Valves
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