Underfill Jetting & Dispensing
Underfill is used in a wide variety of packages and board
level assemblies. Flip chip in package, direct chip attach
on boards, stacked die packages, and various BGA assemblies
are places where underfill is being used in production today.
The "part" to be underfilled can be either a die
or the BGA substrate. While these packages often use different
materials and require different production techniques, the
underfill process is similar for both.
The proliferation of flip chip technology in digital cameras,
cell phones, disk drives, medical devices such as pacemakers, defibrillators and hearing aids, has created a large demand for underfilling
small die in the range of 1 mm square to 5 mm square. Whether
the die are directly attached to flex, circuit boards, or
some organic interposer, the area around the die available
for dispensing underfill materials is getting smaller. This
creates an enormous challenge for needle dispensing, but is
ideal for non-contact jetting. Some underfill applications
may still require traditional needle dispensing, such as with
the DP Series Linear Pump. Contact
Asymtek to find out what fits your application the best.
Successful production requires a flawless underfill process.
With Mass Flow Calibration (MFC), Asymtek's dispensing systems
automatically manage the critical processes related to underfilling:
substrate heating, die finding, underfill volume control,
dispense pattern and part handling. Closed-loop control of
these processes minimizes operator intervention and optimizes
the dispensing programs for highest throughput. All these
processes are programmable in Fluidmove® for
Windows® XP (FmXP) software.
Request More Information
Videos
Related Articles & Papers
Dispensing Systems
- M-2020 Millennium® Ultra High Speed Semiconductor Dispenser
- X-1020 Axiom™ Semiconductor Dispenser
- S-920 Spectrum™ Scalable Dispensing Solutions for Microelectronics Packaging
- S-820 Spectrum™ Precision Batch Semiconductor Dispenser
Jets, Pumps & Valves
- DJ-9000 DispenseJet® The Latest Jet Technology
- DP-3000 Linear Positive Displacement Pump
|
Jetting underfill between two die, which
are 1 mm apart, results in a fillet 0.03 mm wide.
|
