Flip Chip Calculator
 The
Flip Chip Calculator offers a quick and easy way to determine the
volume of underfill necessary to optimize flip chip in package and
flip chip on board dispensing processes.
To utilize the application, the user simply inputs
parameters including die proportions, fillet width and solder bump
profiles, then selects a specific underfill material from the list
of industry-standard fluids in the program.
The software analyzes these user-defined profiles
and calculates the appropriate underfill volume.
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