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Archived Articles & Papers

The following documents are in Adobe Acrobat PDF format. Follow this link for our more recent articles and papers.

General

Feb 2001 - Characterizing Key Process Control Parameters (PDF 831 KB)

Feb 1999 - Conductive Adhesive Dispensing Process Considerations (PDF 227 KB)

Sept 1996 - Determining The Repeatability of Dispensing Samples (PDF 1 MB)

Surface Mount Technology

May 1999 - Non-Contact SMA Jetting: Reliability and Performance (PDF 1.4 MB)

Feb 1999 - Dispensing Conformal Coatings (PDF 455 KB)

Feb 1999 - Best Practices in Surface Mount Adhesive Dispensing (PDF 59 KB)

Jul 1996 - Is Your Solder Paste Dispensable (PDF 557 KB)

Chip Scale Packaging, Encapsulation and Underfill

May 2000 - Novel Jet Fluxing Application for Advanced Flip Chip and BGA /CGA Packages (PDF 82 KB)

Apr 2000 - Secondary Underfill for CSP Reliability (PDF 170 KB)

Mar 2000 - Flip Chip And Chip Scale Packaging Technologies: A Historical Perspective And Future Challenges (PDF 424 KB)

Mar 2000 - When to Underfill Chip Scale Packages, A Review of Design Considerations for Portable Electronic Applications (PDF 2,373 KB)

Jan 2000 - Automating Underfill for Non-Traditional Packages, Secondary CSP Underfill, Stacked Die and No-Flow Underfill (PDF 266 KB)

Jan 2000 - Reliability Formulation for MCM's In The Presence of Stochastically Defined Environments (PDF 79 KB)

Nov 1999 - Reliablility of Encapsulated CSP and DCA Packages (PDF 187 KB)

Sep 1999 - Why Encapsulate CSP to Printed Circuit Board Interconnects (PDF 357 KB)

Sep 1999 - Reliability Statistics for Flip Chip and CSP's Interconnections (PDF 63 KB)

Jul 1999 - Temperature Effects on Encapsulant Dispensing (PDF 335 KB)

Jun 1999 - Precision Dispensing of Liquid Encapsulants for Smart Cards (PDF 1.9 MB)

Feb 1999 - Dam and Fill Encapsulation for Microelectronic Packages (PDF 311 KB)

Feb 1999 - Key Variables For Dispensing Flux & Underfill For Flip Chip Attach (PDF 141 KB)

Feb 1999 - Encapsulation & Underfilling Techniques for Advanced IC Packaging (PDF 104 KB)

Feb 1999 - Die Encapsulation & Flip Chip Underfilling for Area Array Packaging (PDF 251 KB)

Feb 1999 - Controlling Fillet Size in Underfill Process (PDF 80 KB)

Feb 1999 - Cavity Down BGA Processes For Accurate Fluid Dispensing (PDF 126 KB)

Nov 1998 - Reliability & Yield in Flip-Chip Packaging (PDF 205 KB)

Aug 1998 - Flip Chip Encapsulation Reliability (PDF 179 KB)

Aug 1998 - Practices in Automated Underfill Dispensing (PDF 97 KB)

Sep 1997 - Advances in Dispensing Processes for Flip Chip Underfill (PDF 93 KB)

Jul 1997 - Dispensing Requirements for Automating the Underfill Process (PDF 74 KB)

Feb 1997 - The Search for a True Positive Displacement Pump (PDF 74 KB)