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June 2002 Asymtek Contributes
Advanced Semiconductor Application Technology to KAIST University Carlsbad,
CA - Asymtek and the Micro-Electronic Packaging Lab (MEPL) of the Korea
Advanced Institute of Science and Technology (KAIST) in Daejon, Korea have renewed
their two-year agreement to jointly support dispensing reliability studies for
semiconductor packaging applications. This collaboration enables the investigation
of new and innovative methods of semiconductor packaging technologies.
An Asymtek Century® C-720
system is currently in use at KAIST’s Micro-Electronic Packaging
Laboratory, where several companies are conducting dispensing tests
of underfill materials, solder bump reliability, and the development
of flip chip applications. The Century system provides exceptional
dispensing accuracy and reliability for underfill, dam and fill,
cavity fill, die attach, encapsulation and other semiconductor applications.
KAIST’s
mission (www.KAIST.ac.kr) as a government-sponsored research oriented institute
is to educate world-class scientists and engineers, and also to develop leading
edge technologies for Korea’s high-tech industries. “In addition to
allowing us to develop closer partnerships with other companies, our work with
Asymtek will benefit the entire electronics packaging industry,” explains
Dr. Kyung W. Paik, Associate Professor at KAIST. Asymtek supplies award-winning
automated fluid dispensing systems to the semiconductor, surface mount, electronics
packaging and industrial markets. They are committed to offer total dispensing
solutions and local support to customers throughout the world. A complete review
of Asymtek's automated fluid dispensing systems may be found on their Web site
at: http://www.asymtek.com.
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