On Thursday, September 11, 2008, learn from industry experts about the latest developments in coating, assembly materials and jet dispensing technology. Who Should Attend:

• Manufacturing Engineers
• Process Engineers
• Manufacturing Managers
• Operations Managers
• Plant Managers

Presentations from Asymtek, Henkel Technologies, Cyber Technologies, Dow Corning, Dymax Corp., and HumiSeal. Attendees are welcome to bring examples of current or planned applications.
Topics to be Covered: - AGENDA (PDF)

• Conformal coating processes and materials. Learn about different coating materials and the best ways to select, cure and apply them. Topics will include aqueous, acrylic, silicone, and heat-humidity cure materials.
• Fluid jetting processes and material applications. Learn about the advantages of non-contact jetting underfill and other fluid materials for electronics assembly.
• Tin Whiskers and how to avoid them.
• High-resolution, laser based measurement systems for industrial applications.... "non-contact laser system".