Learn how Asymtek's new dispensing solutions scale to meet your changing needs. Introducing the Select Coat® SL-940E and the Spectrum™ 900 Series.

There will be five-minute feature presentations in our booth that will be offered at the following times:

For the latest dispensing technologies and innovations for PCB assembly and semiconductor packaging, be sure to see these live product demonstrations:

Select Coat® SL-940E – Product Launch: Asymtek's new conformal coating platform incorporates vision, closed-loop process controls, precision, and traceability in a high-speed system.

Spectrum™ S-910N – Announcing the inline Spectrum S-910N series for high-volume applications that do no require heat, such as surface mount adhesive (SMA), UV bonding, CMOS imaging, and edge- and corner-bonding applications for mobile phones, PDAs and other handheld electronic devices.

Spectrum™ S-920N – Announcing the inline Spectrum S-920N series that takes the technical capabilities of the Axiom™ product to new levels. With its flexible, scalable configuration, the Spectrum S-920N series is the ideal choice for a wide variety of dispensing applications. It can be configured with single or dual lanes, and one, two or three heat stations depending on your capacity, process control and footprint requirements. As process needs change, the S-920 platform can be upgraded in the field.

Spectrum™ S-822 - The Spectrum™ 820 Series system -- now with dual-lane shuttle -- is designed for batch production of semiconductor packaging processes, such as underfill, cavity fill, die attach, and encapsulation. The S-822 system performs with a wide range of fluids, processes, and substrates used in semiconductor packaging and assembly. The S-820 easily integrates with most jets, pumps and valves from Asymtek, including the DispenseJet® DJ-9000.

Slider Valve SV-100 - The Slider Valve SV-100 for high-speed solder paste dispensing will be demonstrated on the DispenseMate® D-580 series platform.