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Spectrum™ S-910N
Scalable Dispensing Solutions for PCB Assembly and Microelectronics Packaging
Announcing the inline Spectrum series for high-volume applications that do not require heat, such as surface mount adhesive (SMA), UV bonding, CMOS imaging, and edge- and corner-bonding applications for mobile phones, PDAs and other handheld electronic devices.
The inline Spectrum S-910 series takes the technical capabilities of the Axiom™ product line to new levels. With its flexible, scalable configuration, the S-910 platform can be configured with single or dual lanes depending on your capacity and footprint requirements. As process needs change, the system can be upgraded in the field to add options not previously required.
Features
- Slim design maximizes floor space utilization and lowers cost of ownership
- High-speed jetting of a wide variety of materials including SMA, conductive adhesives, corner bond attach, and more
- CADImport software for quick and efficient offline programming
- New digital vision system for high-speed fiducial capture
- Supports all Asymtek jets, encoded auger pumps, spool and pressure/time valves
Recommended Applications
Optional Features for Enhanced Throughput and Process Control
- Dual Lane Configuration
- Programmable fluid and valve pressure control for closed-loop processing, eliminates errors associated with manual operations
- Closed-loop processing with Asymtek-patented MFC (Mass Flow Control) and CpJ™ (Calibrated Process Jetting) for automatic fluid weight measurement and adjustment
- Pre- and post-stations without heat can be added for higher throughput or as buffer stations
- Laser Height Sensor
- Exterior Bulk Fluid Reservoir
- SECS/GEM Interface Software
| If you're planning to install an Asymtek
piece of equipment, please check with your Asymtek representative
for the exact dimensions. The dimensions shown in the following
brochures are subject to change between publication dates.
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